Leiterplatten

Single Sided - 24 Layers PCB
Backplane
High Tg Material
Impedance Control
OSP / Entek, Flash Gold, HAL, HAL Leadfree, Chemical Gold, Chemical Tin, Chemical Siver
Carbon Ink / Jumper, Gold Fingers, Peelable Soldermask, Kapton Tape
No Minimum Order
Low One-time Cost (Setup & Etesting Costs)
FOB Hong Kong, CIF (Airport / Seaport) DDU (Door to Door)


Technical Data Descriptions
No. of Layers Available 1 - 24
Min. Line Width 0.10 mm
Min Line Spacing 0.10 mm
Min. Annual Ring PTH 0.15 mm
Non-PTH 0.20 mm
Min Hole Size PTH 0.25 mm
Non-PTH 0.30 mm
Hole Aspect Ratio 5
Min. Board Thickness Single & Double Sided 0.3 mm
Multilayer (4,6,8,10) 0.4 mm, 1.0 mm, 1.2 mm, 1.5 mm
Max Board Size 450 mm x 600 mm
Solder Mask Pitch 0.1 mm
Hole Tolerance PTH +/- 0.076 mm
Non-PTH +/- 0.05 mm
Hole Position Tolerance   +/- 0.076 mm
Outline Tolerance Routing +/- 0.15 mm
Punching +/- 0.15 mm
Thickness Tolerance MIL-P-13949 Class 2
V-Cut Tolerance Depth +/- 0.15 mm
Position +/- 0.15 mm
Gold Finger

5μ" - 50μ"